Conducting adhesives have developed into industrially important materials. At the same time, new fields of applications, electronic assembly on flexible printing substrates, for example, places new demands on this type of materials and the interconnects they form.
We have the pleasure to announce a seminar to be held by Johan Liu from Chalmers. The seminar is followed by workshops where characterization methods, stability and recent developments are to be discussed
Agenda
10:30 – 11:30 Seminar by Professor Johan Liu, Chalmers
Title: Conductive adhesives for micro-assembly. State-of-the-art and current developments
11:30 – 12:15 Micro-assembly and printing at Printed Electronics Arena (PEA)
12:30– 13:30 Lunch (Place: Östsvenska handelskammaren)
13:30 – 16:00 Workshops
(limited number of participants)
WS1. Characterization of conductive adhesive joints, electrically and mechanically
WS2. Materials and stability
WS3. Challenges, issues and current development
WS4. Space for other topics
Registration and questions by November 23, 2018 via email to: mats.sandberg@ri.se
Registration fee: 500 SEK (invoiced later, not for partners of organizing projects)